穆德魁
穆德魁 2016-04-05

2B7A?e=.jpg


个人简介:

穆德魁,博士,副教授,硕士生导师


研究方向:

金属间化合物晶体结构与力学性能;


研究领域:

电子封装;钎焊


学习工作经历:

学习经历:

1997-2001:北京航空航天大学,本科毕业

2004-2008:昆士兰科技大学 (Queensland University of Technology, Australia), 机械工程(Mechanical Engineering),学士(Bachelor),硕士 (M. Phil.)

2009-2012:昆士兰大学 (The University of Queensland, Australia), 材料科学与工程 (Material Science and Engineering), 博士(2011年3月至2011年4月:交换学生,大阪大学(Osaka University, Osaka, Japan))


工作经历:

2012年11月-2013年7月: 博士后研究员,昆士兰大学 (The University of Queensland,Brisbane, Australia)

2013年8月至2014年6月: 研发工程师,斯培利亚(Nihon Superior Co.,Ltd,Osaka,Japan)

2014年9月至2015年8月: 讲师,江苏科技大学

2015年9月至今:  副教授,华侨大学


主要论著与学术论文:

1. D.Mu, S.D. McDonald, J. Read, H. Huang and K. Nogta: Critical Properties of Cu6Sn5 in Electronic Devices: Recent Progress and A Review. Current Opinion in Solid State & Materials Science. 20,55-76 (2016).

2. G.Zeng, S.D. McDonald, D. Mu, K.Nogita, Y. Terada, H. Yasuda, Q.F. Gu, K, Nogita: Ni segregation in the interfacial (Cu, Ni)6Sn5 intermetallic layer of Sn-0.7 Cu-0.05 Ni/Cu ball grid array (BGA) joints. Intermetallics, 54, 21-27 (2014).

3. Y.F. Yang, D. Mu, Q.C. Jiang: A simple route to fabricate TiC-TiB2/Ni composite via thermal explosion reaction assisted with external pressure in air. Materials Chemistry and Physics,143, 480-485 (2014).

4. Y. F. Yang, D. Mu: Simultaneous dehydrogenation and synthesis of TiB2-TiC through self-propagation high-temperature synthesis from TiH2-B4C powder blends. Metallurgical and Materials Transactions A., 34, 3184-3188 (2014).

5. Y. F. Yang, D. Mu: Effects of Ni additions on the formation of Ti5Si3 prepared by self-propagation high-temperature synthesis. Journal of the European Ceramic Society,34, 2177-2185 (2014).

6. Y. F. Yang, D. Mu: Dehydrogenation process and its effect on formation mechanism of TiC during self-propagation high-temperature synthesis from TiH2-C. Powder Technology,249 208-211 (2013).

7. D. Mu, H. Huang, S. D. McDonald, J. Read and K. Nogita: Investigating the Mechanical Properties, Creep and Crack Pattern of Cu6Sn5 and (Cu,Ni)6Sn5 on Diverse Crystal Planes. Material Science and Engineering A, 566, 126 (2013).

8. D. Mu, H. Huang, S. D. McDonald and K. Nogita: Creep and Mechanical Properties of Cu6Sn5 and (Cu,Ni)6Sn5 at Elevated Temperatures. Journal of Electronic Materials, 42, 304 (2013).

9. D. Mu, H. Yasuda, H. Huang and K. Nogita: Growth orientation and mechanical properties of Cu6Sn5 and (Cu,Ni)6Sn5 on poly-crystalline Cu. Journal of Alloys and Compounds, 536, 39 (2012).

10. D. Mu, H. Huang and K. Nogita: Anisotropic mechanical properties of Cu6Sn5 and (Cu,Ni)6Sn5. Materials Letters, 86, 46 (2012).

11. K. Nogita, D. Mu, S. D. McDonald, J. Read and Y.Q. Wu: Effect of Ni on phase stability and thermal expansion of Cu6-XNiXSn5. Intermetallics, 26, 78 (2012).

12. D. Mu, J. Read, Y. F. Yang and K. Nogita: Thermal expansion of Cu6Sn5 and (Cu,Ni)6Sn5. Journal of Material Research, 26, 2660 (2011).

13. D. Mu, H. Tsukamoto, H. Huang and K. Nogita: Formation and mechanical properties of intermetallic compounds in Sn-Cu high-temperature lead-free solder joints. Material Science Forum, Vol. 654, 2450 (2010).

14. D. Mu, Y. Sun and L. Ma, “Reliability of Multi-state Repairable Systems with Dependent Deteriorations”, Proceeding of Third Congress on Asset Management, Beijing, China, Oct., 2008.


联系方式:

联系电话:

电子邮箱:dekui.mu@uqconnect.edu.au


微信扫一扫

关注机电及自动化学院公众号