方从富

方从富 2016-03-14


个人简介:

方从富,男,1980年出生于安徽,博士,副研究员,硕士生导师。2010年于华侨大学机械制造及自动化专业博士毕业后留校任教,2018年公派在澳大利亚新南威尔士大学进行为期一年的访学。主要从事智能制造和先进检测技术教学与科研工作。研究方向:高效精密加工、智能制造与装备;研究领域:智能制造与精密加工技术、过程建模与模拟仿真技术、高端工具设计与制备技术、智能图像处理与应用技术、计算机控制装备设计开发等。主持和参加国家科技部重大专项、国家自然科学基金重点项目、国家自然科学基金项目以及省部级项目十余项,发表学术论文30余篇,申请发明专利十余项(已授权6项)。现为International Journal of Advanced Manufacturing Technology、Materials and Design、Advances in Mechanical Engineering、Journal of Cleaner Production、Journal of Mechanical Engineering Science、Chinese Optics Letters、International Journal of Pattern Recognition and Artificial Intelligence等国际期刊审稿人,国家自然科学基金通信评审专家。


主要任职:

福建晶安光电有限公司技术顾问


研究方向:

高效精密加工、智能制造与装备


研究领域:

智能制造与精密加工技术

过程建模与模拟仿真技术

高端工具设计与制备技术

智能图像处理与应用技术

计算机控制装备设计开发


学习工作经历

2010.03— 至 今:华侨大学机电及自动化学院,教师;

2018.03—2019.03:澳大利亚新南威尔士大学,访问学者;

2004.09—2010.01:华侨大学机电及自动化学院,工学博士;

2000.09—2004.07:华侨大学机电及自动化学院,工学学士;


主持或参加的科研项目:

[1] 国家自然科学基金面上项目(51675193),主持;

[2] 国家自然科学基金青年项目(51305145),主持;

[3] 福建省自然科学基金面上项目(2016J01235),主持;

[4] 福建省教育厅科技计划项目(JA12011),主持;

[5] 华侨大学中青年教师科研提升资助计划项目(ZQN-PY303),主持;

[6] 华侨大学高层次人才启动项目(10BS211),主持;

[7] 国家科技支撑计划数控重大专项(2012BAF3B04),参与;

[8] 国家自然科学基金重点项目(U305241),参与;

[9] 国家自然科学基金重点项目(51235004),参与;

[10] 国家自然科学基金面上项目(51175193),参与;

[11] 福建省高校产学合作项目(2018H602),参与;


主要论著与学术论文:

[1] Fang CF, Yan Z, Deng WW, Zhang LC. Material removal in grinding sapphire wafers with brazed-diamond pellet plates. Materials and Manufacturing Processes, 2019, In Press. (SCI)

[2] Zhang YZ, Fang CF, Huang GQ, Xu XP. Modeling and simulation of the distribution of undeformed chip thicknesses in surface grinding. International Journal of Machine Tools and Manufacture, 127:14~27, 2018. (SCI)

[3] Fang CF, Yan Z, Hu ZW, Lin YF, Zhao ZX. Pattern design of fixed abrasive pads inspired by the bee colony theory. The International Journal of Advanced Manufacturing Technology, 97:2563~2574, 2018. (SCI)

[4] Wang LJ, Hu ZW, Fang CF, Yu YQ, Xu XP. Study on the double-sided grinding of sapphire substrates with the trajectory method. Precision Engineering, 51:308~318, 2018. (SCI)

[5] Fang CF, Liu C, Zhao ZX, Lin YF, Hu ZW, Xu XP. Study on geometrical patterns of textured fixed-abrasive pads in sapphire lapping based on trajectory analysis. Precision Engineering, 53:169~178, 2018. (SCI)

[6] Lin YF, Fang CF. Study on the segmentation of abrasive grains in diamond tools. International Journal of Abrasive Technology, 8(3):203~217, 2018. (EI)

[7] Fang CF, Zhao ZX, Hu ZW. Pattern Optimization for phyllotactic fixed abrasive pads based on the trajectory method. IEEE Transactions on Semiconductor Manufacturing, 30(1):78~85, 2017. (SCI)

[8] Hu ZW, Fang CF, Deng WW, Zhao ZX, Lin YF, Xu XP. Speed ratio optimization for ceramic lapping with fixed diamond pellets. International Journal of Advanced Manufacturing Technology, 90:3159~3169, 2017. (SCI)

[9] Fang CF, Zhao ZX, Lu LY, Lin YF. Influence of fixed abrasive configuration on the polishing process of silicon wafers. International Journal of Advanced Manufacturing Technology, 88:575-584, 2017. (SCI)

[10] Fang CF, Lin YF, Xu XP. A thermal model for the calculation of energy partitions in sawing with a segmented blade. High Temperatures-High Pressures, 45(1):35-56, 2016. (SCI)

[11] Liu Q, Huang GQ, Xu XP, Fang CF, Cui CC. Influence of grinding fiber angles on grinding of the 2D-Cf/C-SiC composites. Ceramics International, 44:12774~12782, 2018. (SCI)

[12] Lin YF, Wu F, Fang CF. Fang. Wear feature extraction for diamond abrasives based on image processing techniques. Advances in Energy, Environment and Materials Science, 823-827, 2016. (EI)

[13] Fang CF, Xu XP. Analysis of temperature distributions in surface grinding with intermittent wheels. International Journal of Advanced Manufacturing Technology, 71:23–31, 2014. (SCI)

[14] Liu Q, Huang GQ, Fang CF, Cui CC, Xu XP. Experimental investigations on grinding characteristics and removal mechanisms of 2D-Cf/C-SiC composites based on reinforced fiber orientations. Ceramics International, 43:15266~15274, 2018. (SCI)

[15] Liu Q, Huang GQ, Xu XP, Fang CF, Cui CC. A study on the surface grinding of 2D C/SiC composites. International Journal of Advanced Manufacturing Technology, 93:1595~1603, 2017. (SCI)


联系方式:

手机:13656026907

邮箱:cffang@hqu.edu.cn

地址:福建省厦门市集美大道668号华侨大学机电及自动化学院

邮编:361021


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